Sizzix Accessory - Die Brush & Foam Pad for Wafer-Thin Dies

Item #660513
660513
Overview
Sizzix 101

Sizzix 101

Sizzix 101

Class is now in session! Discover all the essentials to empower your creativity.

Learn More
On Sale Today
(While Supplies Last)

Regular Price: $9.99

Special Price $6.00

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

Product Dimensions Die Brush: 5 1/2" x 1 3/4" x 1/4". Foam Pad: 4 1/2" x 7 1/4".
Includes 1 Die Brush, 1 Foam Pad

Request From WebServer2 172.31.25.198